Principal Mechanical Engineer

• We are looking to add a Principal Mechanical Design Engineer I to our team
• In this position, you will be responsible for the mechanical design of Cesium products through all phases of the development process
• As a principal mechanical team member, you will be responsible for mechanical designs from initial concept design through requirements definition, detailed design, simulation, analysis, manufacturing, testing, qualification, and in-orbit support of Cesium’s products
• Principal engineers also serve as technical and professional mentors in their field, helping to cultivate and develop junior engineers on the team
• The successful candidate will also present engineering design review materials to our customers and executive team, as well as participate in proposal-writing efforts. As such, excellent written and verbal communication skills are required

Benefits

• Health, dental, vision
• HSA and FSA
• Company stock options
• Life, disability and retirement plans

If you enjoy working in a startup environment, and are passionate about developing leading-edge hardware for satellites, spacecraft, and aerospace systems, we would like to hear from you

The ideal candidate will have extensive experience in electronics packaging design, mechanical simulations and analyses, computer-aided design (CAD), spacecraft mechanical interfaces, and environmental qualification of electronic assemblies

Required skills and experience include thermal management design, precision machining principles, thermal simulation and analysis, shock and vibration simulation and analysis, electromagnetic interference/compatibility (EMI/EMC) mitigation techniques, geometric dimensioning and tolerancing (GD&T), finite element analysis (FEA), and cost analysis to develop, validate, and optimize mechanical designs

Excellent written and verbal communication skills

Experience with CNC manufacturing

Expertise in aerospace and space industry design, development, and qualification

A Bachelor of Science (BS) or Master of Science (MS) degree in Mechanical or Aerospace Engineering from an accredited university or institution

9 years of industry experience in design and analysis of electronics packaging, including thermal, vibration, and stress dynamics hand calculations and simulations

Expert-level proficiency with professional mechanical CAD (SolidWorks preferred) and FEA tools (Ansys preferred)

Expert-level proficiency with electronics assemblies and experience working closely with electrical engineers on printed circuit board assemblies (PCBAs, CCAs)

Experience with EMI/EMC mitigation techniques